LOCTITE® 3621
Tuntud kui Chipbonder 3621
Omadused ja eelised
This electrically non-conductive adhesive is designed for bonding surface mounted devices to printed circuit boards prior to wave soldering. Perfect where dispense speeds greater than 35,000 dots/h are required.
LOCTITE® 3621 is a surface mount adhesive specially designed for bonding surface mounted devices to printed circuit boards prior to wave soldering, and is ideal for applications where very high dispense speeds (greater than 35,000 dots/h), high dot profile, high wet strength, and good electrical characteristics are required.
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Tehniline teave
| Füüsiline vorm | Geel |
| Kasseti viskoossus, koonus ja plaat Haake PK100, M10/PK1, 2°, @ 25.0 °C | 0.5 - 3.0 Pa∙s |
| Komponentide arv | 1-komponentne |
| Kõvenemisaeg, @ 150.0 °C | 90.0 - 120.0 sekund |
| Nihkejõud, Teras (abrasiivpulber) | 2175.0 psi |
| Soojuspaisumise koefitsient (CTE), Above Tg | 100.0 ppm/°C |
| Säilitustemperatuur | 2.0 - 8.0 °C |
| Tahkumistüüp | Kuumkõvenemine |
| Voolavuspiir, koonus ja plaat, Haake PK100, M10/PK1, 2°, @ 25.0 °C | 130.0 - 280.0 Pa∙s |
LOCTITE® 3621
This electrically non-conductive adhesive is designed for bonding surface mounted devices to printed circuit boards prior to wave soldering. Perfect where dispense speeds greater than 35,000 dots/h are required.