LOCTITE® 3621
Conhecido como Chipbonder 3621
Características e Benefícios
This electrically non-conductive adhesive is designed for bonding surface mounted devices to printed circuit boards prior to wave soldering. Perfect where dispense speeds greater than 35,000 dots/h are required.
LOCTITE® 3621 is a surface mount adhesive specially designed for bonding surface mounted devices to printed circuit boards prior to wave soldering, and is ideal for applications where very high dispense speeds (greater than 35,000 dots/h), high dot profile, high wet strength, and good electrical characteristics are required.
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Informação Técnica
| Casson viscosidade, cone & placa Haake PK100, M10/PK1, 2°, @ 25.0 °C | 0.5 - 3.0 Pa∙s |
| Coeficiente de expansão térmica (CTE), Above Tg | 100.0 ppm/°C |
| Cronograma de cura, @ 150.0 °C | 90.0 - 120.0 seg. |
| Forma física | Gel |
| Força de cisalhamento, Aço (jateado) | 2175.0 psi |
| Limite de escoamento, cone e placa, Haake PK100, M10/PK1, 2°, @ 25.0 °C | 130.0 - 280.0 Pa∙s |
| Número de componentes | Monocomponente |
| Temperatura de armazenamento | 2.0 - 8.0 °C |
| Tipo de cura | Cura por Calor |
LOCTITE® 3621
This electrically non-conductive adhesive is designed for bonding surface mounted devices to printed circuit boards prior to wave soldering. Perfect where dispense speeds greater than 35,000 dots/h are required.