LOCTITE® 3621
Conocido como Chipbonder 3621
Características y Ventajas
This electrically non-conductive adhesive is designed for bonding surface mounted devices to printed circuit boards prior to wave soldering. Perfect where dispense speeds greater than 35,000 dots/h are required.
LOCTITE® 3621 is a surface mount adhesive specially designed for bonding surface mounted devices to printed circuit boards prior to wave soldering, and is ideal for applications where very high dispense speeds (greater than 35,000 dots/h), high dot profile, high wet strength, and good electrical characteristics are required.
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Información técnica
| Casson viscosidad, cono & placa Haake PK100, M10/PK1, 2°, @ 25.0 °C | 0.5 - 3.0 Pa∙s |
| Coeficiente de dilatación térmica (CDT), Above Tg | 100.0 ppm/°C |
| Forma física | Gel |
| Número de componentes | Monocomponente |
| Programa de curado, @ 150.0 °C | 90.0 - 120.0 s |
| Punto de cedencia, cono y placa, Haake PK100, M10/PK1, 2°, @ 25.0 °C | 130.0 - 280.0 Pa∙s |
| Resistencia al corte, Acero (granallado) | 2175.0 psi |
| Temperatura de almacenaje | 2.0 - 8.0 °C |
| Tipo de curado | Curado Térmico |
LOCTITE® 3621
This electrically non-conductive adhesive is designed for bonding surface mounted devices to printed circuit boards prior to wave soldering. Perfect where dispense speeds greater than 35,000 dots/h are required.