BERGQUIST® GAP PAD® TGP 5000
Tuntud kui Gap Pad® 5000S35
Omadused ja eelised
This thermally conductive, silicone-based, fibreglass-reinforced gap pad filler has a high thermal conductivity rating of 5.0 W/m-K.
BERGQUIST® GAP PAD® TGP 5000 is a highly conformable material with natural inherent tack, which reduces interface thermal resistance. Due to the highly flexible and elastic nature of the material, it easily conforms to unique contours while maintaining structural integrity and without applying stress to fragile components. Reinforced with fibreglass to protect against punctures, and with improved shear and tear resistance and natural tack on both sides, this product is easy to handle and ideal for high-performance applications at low mounting pressures.
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Tehniline teave
| Arvestuslik leegikindlus | V-0 |
| Dielektriline konstant, @ 1kHz | 7.5 |
| Dielektriline läbilöögipinge | 5000.0 Vac |
| Mahu resistiivsus | 1×10 Ohm m |
| Shore’i kõvadus, Thirty second delay value, ASTM D2240 Puistkumm Shore 00 | 35.0 |
| Soojusjuhtivus | 5.0 W/mK |
| Soojusmahtuvus, ASTM E1269 | 1.0 J/g-K |
| Standardpaksus | 0.508 - 3.175 mm |
| Tihedus | 3.6 g/cm³ |
| Töötemperatuur | -60.0 - 200.0 °C |
| Värvus | Heleroheline |
BERGQUIST® GAP PAD® TGP 5000
This thermally conductive, silicone-based, fibreglass-reinforced gap pad filler has a high thermal conductivity rating of 5.0 W/m-K.