BERGQUIST® GAP PAD® TGP 2400
Tuntud kui Gap Pad® 2500S20
Omadused ja eelised
This thermally conductive, silicone-based, fiberglass-reinforced gap pad filler has a thermal conductivity rating of 2.4 W/m-K. Perfect for low stress sensitive applications.
BERGQUIST® GAP PAD® TGP 2400 is a pre-cured, silicone-based, thermally conductive reinforced gap pad. It is highly conformable, exhibits thermal resistance and softness, and is fiberglass reinforced and therefore offers resistance against puncture, shear and tear. This product is well suited for high performance, low stress sensitive applications.
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Tehniline teave
| Arvestuslik leegikindlus | V-0 |
| Dielektriline konstant, @ 1kHz | 6.6 |
| Dielektriline läbilöögipinge | 3000.0 Vac |
| Mahu resistiivsus | 1×10 Ohm m |
| Shore’i kõvadus, Thirty second delay value, ASTM D2240 Puistkumm Shore 00 | 20.0 |
| Soojusjuhtivus | 2.4 W/mK |
| Soojusmahtuvus, ASTM E1269 | 1.0 J/g-K |
| Standardpaksus | 0.254 - 6.35 mm |
| Tihedus | 3.1 g/cm³ |
| Värvus | Helekollane |
BERGQUIST® GAP PAD® TGP 2400
This thermally conductive, silicone-based, fiberglass-reinforced gap pad filler has a thermal conductivity rating of 2.4 W/m-K. Perfect for low stress sensitive applications.